Infineon Links Digital to the Real life with New Decarbonization and IoT Solutions

Infineon Technologies today announced intends to highlight the way it links the actual towards the digital world by enabling smart and connected applications at Embedded World 2022 in Nuremberg. A prerequisite for unlocking the potential of the IoT and decarbonization. The company will showcase a variety of smart IoT applications in sectors including smart building and houses, smart factories and smart mobility, and its latest software and tools for system builders and makers working across the electronics industry.

With its motto \”Building new Connections\” Infineon looks toward greeting customers in person again this year. Located in hall 4a (booth 138), the business's booth will include several focus areas:

• Smart home and smart buildings. Using its pursuit to make life easier, safer and greener, Infineon's broad portfolio of IoT solutions helps companies offer consumers much more comfortable, safe and energy-efficient homes and buildings, using the company's latest microcontroller, sensor, security and connectivity solutions.
• Smart mobility. Like a leader in automotive solutions, the company is focused on making smart cars a reality using proven automotive-grade microcontrollers, connectivity, security and sensor technologies. The company's microelectronics play a critical role in delivering zero-emissions vehicles that are smart, connected, safe and dependable.
• Smart factory. Empowering the smart factory with semiconductors, Infineon reaches the core of shaping industry 4.0, also known as industrial IoT. By enabling the smart factory, Infineon is helping to create manufacturing enterprises environmentally sustainable and achieve superior operational efficiency.
• Driven by the passion of Makers, hobbyists, students and technology enthusiasts, Infineon provides the right tools, services, kits, shields & boards for just about any project idea-from lab to fab. Supported by Infineon experts and a robust developer ecosystem and community, the company helps discover the perfect path to turn ideas into solutions.
• Software and tools. Infineon's proven development platforms give manufacturers a significant advantage by presenting all of them with all the tools in their fingertips while since the full IoT spectrum-from sensing and connecting, to computing and securing.

Customers may also sign up for the virtual booth.

Infineon's Division President from the Connected Secure Solutions Division, Thomas Rosteck, will be presenting \”Innovating IoT at the Edge: Connected, AI-enabled and Secure\” , June 21 @ 1:45 pm CEST. The presentation will give you details on how connectivity, security and artificial intelligence (AI) are the backbones of the future of IoT. Additional conference presentations include:

Wednesday, June 22, 2022

• \”Embedded Cloud Services\” at 10:00 CEST, presented by Josef Pauli. This workshop will teach the audience how to build their very own embedded cloud application based on the Infineon PSoCTM 65 standard secured AWS microcontroller.
• \”The Matter Standard Secures the Smart Home\” at 11:00 am CEST, presented by Steve Hanna. This presentation will talk about how the Matter standard will enable seamless, agnostic interoperability with strong security and privacy protection for smart home applications.
• \”Enhanced Automotive Security and Interoperability with TPM 2.0 in an AUTOSAR Compliant Microcontroller System\” at 12:00 pm CEST, presented by Florian Schreiner. This presentation will discuss how the TPM 2.0 standards are integrated into the Automotive Open System Architecture (AUTOSAR) architecture, in accordance with the safety functionality from the TPM library specification and TSS host software (TPM Software Stack).
• \”eSIM M2M or Consumer – How you can Select the Right eSIM Solution for the Application?\” at 1:45 pm CEST, presented by Oliver Carron. This presentation will highlight the differences between M2M and Consumer specifications, and supply guidance on the way to select the right eSIM solution depending on device type, application and business model.

Thursday, June 23, 2022

• \”Bluetooth Mesh: Connecting the Next Wave of IoT Technology\” at 2:15 pm CEST, presented by David Egan. This presentation will talk in detail about the new Bluetooth Mesh networking standard, when compared with other options including Zigbee and Wi-Fi.

Located at Infineon's booth, the organization has set up an extensive number of \”TechTalks.\” The 26 half-hour presentations, starting at every half hour, covers an extensive area of different topics, from software to product, consumer to industry, and maker to professionals.

Infineon at Embedded World

Embedded World is going to be held from 21 to 23 June 2022 in Nuremberg, Germany. Infineon can have its solutions and products in hall 4a, booth #138 and virtually. Company representatives are also holding several presentations in the accompanying Embedded World Conference, followed by discussions using the speakers.